< Microtechnology

Materials

Overview

Resources with overviews of materials and their most prominent uses:

Overview table of microfabrication materials

Microfabrication Materials Overview Table
MaterialTypical useDensity [g/cm3]Atm. Mass[g/mol]Youngs Modulus[GPa]Shear modulus [GPa]El. ConductivityTherm. Cond.[W·m−1·K−1]Melting point[K]Notes
AluminiumLeads2.7026.98702626.50 nΩ·m237933.47 K (660.32 °C)Add notes
Gallium ArsenideLight emitter5.3176144.645youngsbulkel.therm.1238°C (1511 K)Bandgap 1.424 eV
Gallium NitrideBlue Light emitter6.183.7297youngsbulkel.therm.K ( °C)Add notes
Polysiliconsolar cellsdenamuyoungsbulkel.therm.K ( °C)highly dependent on doping and annealing. Se detailed table in the silicon section
SiliconWafers, semiconductor2.3328.0855(3)47bulkel.1491687 K (1414 °C)highly dependent on doping. Se detailed table in the silicon section
Silicon dioxide, silicainsulator, light waveguidedenamuyoungsbulkel.therm.K ( °C)Add notes
Silicon nitrideinsulatordenamuyoungsbulkel.therm.K ( °C)Add notes
GoldCoating of leads19.3196.9665697822022.14 nΩ·m3181337.33 K (1064.18 °C)Add notes
NickelMEMS, leadsdenamuyoungsbulkel.therm.K ( °C)Add notes
PlatinumContact padsdenamuyoungsbulkel.therm.K ( °C)Add notes
PMMA1.1950.000-950.000youngsbulkel.therm.378 K (105°C) glass trans.Refractive index 1.492
SU8 polymerdenamuyoungsbulkel.therm.K ( °C)Add notes
Tungstendenamuyoungsbulkel.therm.K ( °C)Add notes

This table should be merged with the above...

Metal Material Properties
Mechanical Thermal Electrical
Yield Str.Youngs.Pois.DensityTh. Cond.Th. Exp.MeltingEl. cond.α
Highest ZMaterialGPaGPa?kg/m³(W/cmK)(ppm/K)KΩmpromille/K
Metals
34Al0.17700.3426982.362366026.5*10??4.3
55Au?78-800.44-0.25192813.1214106423-22.1*10??3.7
66Cr???7194??1860?
55Ti0.231160.3245080.28.51670420*10??3.8
80Pt0.121680.38214500.738.917720.0981?3.9
78W0.124110.28192541.84.533870.0489?4.8
65Ag??????96015.9*10??
56Fe12.61960.2978730.80311.7-12154089E6.6
Semimetals
12Graphite???2266??37007-60E-0.4
Semiconductors
25Si intrinsic7190?23291.572.3314102.5*10³
25poly Si?150-1700.3-0.06623200.5-0.342.6?22000
25SiC21700?32003.53.3??
45InP?7.1E11 dyn cm-2?48100.68 W cm-1 °C-14.60·10-6 °C-11060?
Insulators
12Diamond531035?3500201?2.7
34Al2O315.4530?40000.55.4??
25SiO2 (bulk)8.473?25-21500.0140.55?E-12

Units

  • 1 g/cm3 = 1 kg/L = 1000 kg/m3
  • g/mol = amu = Da

Applications and Uses

  • Microprocessors
  • Transistors
  • Lab-on-a-chip
  • MEMS

Product Life-Cycles

Cheap and disposable point-of-care microfluidic chips require very different materials compared to high performance microprocessors.

Environmental Considerations

The environmental footprint of microfabriaction is not discussed very often. If anyone has knowledge about this I hope they will contribute!!

Wafers and Substrates

Overview of wafer types, flats, cleaving planes etc.

References

See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.

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